EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Basic information More.. Product Name: EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Synonyms: EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION CAS: MF: O** MW: 15.9994 EINECS: Mol File: Mol File Information Error Report Your Email:

Browse by province EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Suppliers Global suppliers Taiwan(1) All(1) EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION Recommend Suppliers Recommend You Select Member Companies... Company Name: ChangChun Plastics. Co. Ltd.      Recommend    Complaint Tel: (02)25001800 FAX: (02)2501-8018 Email: Products Intro:    More... CB Index: 57 WebSite: www.chemicalbook.com/ShowSupplierProductsList12286/0.htm Related Information: Sales Network   Catalog(83)   User Evaluation 1

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