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| CAS No. |
7440-50-8 |
| Chemical Name: |
Copper |
| Synonyms: |
Cu;m3r;m3s;cum3;COPPER;cda101;cda102;cda110;cda122;ce1110 |
| CBNumber: |
CB2165990 |
| Molecular Formula: |
Cu |
| Formula Weight: |
63.55 |
| MOL File: |
7440-50-8.mol |
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Copper
Property |
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Melting point : |
1083.4 °C(lit.)
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Water Solubility : |
insoluble |
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Stability:: |
Stable. Incompatible with strong acids, active halogen compounds, chlorine, fluorine, iodine, bromine, ammonia. May react explosively with strong oxidizing agents. |
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SAFETY
- Risk and Safety Statements
- Hazard and Precautionary Statements (GHS)
| Symbol(GHS): |
  
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| Signal word: |
Danger |
| Hazard statements: |
| Code |
Hazard statements |
Hazard class |
Category |
Signal word |
Pictogram |
P-Codes |
| H228 |
Flammable solid |
Flammable solids |
Category 1
Category 2 |
Danger
Warning |
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P210, P240,P241, P280, P370+P378 |
| H319 |
Causes serious eye irritation |
Serious eye damage/eye irritation |
Category 2A |
Warning |
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P264, P280, P305+P351+P338,P337+P313P |
| H335 |
May cause respiratory irritation |
Specific target organ toxicity, single exposure;Respiratory tract irritation |
Category 3 |
Warning |
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| H401 |
Toxic to aquatic life |
Hazardous to the aquatic environment, acute hazard |
Category 2 |
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P273, P501 |
| H410 |
Very toxic to aquatic life with long lasting effects |
Hazardous to the aquatic environment, long-term hazard |
Category 1 |
Warning |
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P273, P391, P501 |
| H411 |
Toxic to aquatic life with long lasting effects |
Hazardous to the aquatic environment, long-term hazard |
Category 2 |
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| Precautionary statements: |
| P210 |
Keep away from heat/sparks/open flames/hot surfaces. — No smoking. |
| P261 |
Avoid breathing dust/fume/gas/mist/vapours/spray. |
| P273 |
Avoid release to the environment. |
| P280 |
Wear protective gloves/protective clothing/eye protection/face protection. |
| P304+P340 |
IF INHALED: Remove victim to fresh air and Keep at rest in a position comfortable for breathing. |
| P305+P351+P338 |
IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continuerinsing. |
| P405 |
Store locked up. |
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Copper
Chemical Properties,Usage,Production
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Chemical Properties
Raddish powder |
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General Description
Reddish lustrous malleable odorless metallic solid. |
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Air & Water Reactions
Solid pieces are very slowly oxidized by air to give a green basic carbonate. Solid pieces become covered by a black oxide when heated in air. Insoluble in water. |
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Reactivity Profile
Copper combines violently with chlorine trifluoride in the presence of carbon [Mellor 2, Supp. 1, 1956]. Is oxidized by sodium peroxide with incandescence [Mellor 2:490-93, 1946-1947]. Forms an unstable acetylide when acetylene is passed over samples that have been heated enough to form an oxide coating. Reacts more rapidly in powdered or granular form. Subject to explosive reaction then mixed in finely divided form with finely divided bromates chlorates and iodates of barium, calcium, magnesium, potassium, sodium, or zinc; these reactions are initiated by heat, percussion, and occasionally light friction [Mellor 2:310, 1946-1947]. A solution of sodium azide in Copper pipe with lead joints formed Copper azide and lead azide, both of these compounds can detonate [Klotz, 1973]. |
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Copper
Preparation Products And Raw materials |
Raw materials
Sodium sulfite
CHALCOPYRITE
Copper sulfate pentahydrate
Copper(II) sulfate
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Preparation Products
Cupric nitrate
2-PHENYL-4-[3H]QUINAZOLINONE
1-(2-fluoro[1,1'-biphenyl]-4-yl)ethan-1-one
TERT-BUTYL 4-(5-FORMYLPYRID-2-YL)PIPERAZINE-1-CARBOXYLATE
Arsenic-copper alloy
Lobenzarit
Copper dinitrate
5-Methoxysalicylic acid
FLAVANTHRONE
4-Ethylphenol
DIALLYL MALEATE
Tolclofos-methyl
Pyriproxyfen
1-(2-amino[1,1'-biphenyl]-4-yl)ethan-1-one
1,4-DINITROBENZENE
2,4-DIMETHYLQUINOLINE
5-Hydroxyvanillin
5-METHOXYBENZOFURAN-2-BORONIC ACID
5-Hydroxyanthranilic acid
1-(2-NITRO-BIPHENYL-4-YL)-ETHANONE
SOLVENT YELLOW 85
1,2,3,4-Butanetetracarboxylic acid
9(10H)-ACRIDONE
4-CHLORO-2-PHENYLQUINAZOLINE
Masoprocol
lithium-ion battery
2-((4-ETHOXYPHENYL)AMINO)-4-NITROBENZOIC ACID
2-(2-AMINO-4-BIPHENYL)PROPIONITRILE
3-AMINO-6-METHOXYPYRIDAZINE
polyimide adhesive YJ-8 for strain gauge
4-Iodophenol
3-Bromotoluene
1,2-Dinitrobenzene
2-Bromotoluene
Vat Orange 11
3-Methylfuran
(1,1-DIMETHYL-PROP-2-YNYL)-HYDRAZINE
COMBRETASTATIN A-4
N,N,N',N'-Tetraphenylbenzidine
4-Iodophenoxyacetic acid
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Copper
Suppliers Global( 233)Suppliers
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Copper gauze, Woven from 0.056mm (0.0022 in.) dia. wire
Copper, Solid
Copper gauze, Woven from 0.23mm (0.009 in.) dia. wire
Copper sputtering target, 50.8mm (2.0 in.) dia. x 6.35mm (0.250 in.) thick
Copper rod, 19mm (0.8 in.) dia.
Copper rod, 9.5mm (0.4 in.) dia.
Copper standard solution, 1 mg/ml Cu in 2% HNO3
Copper plasma standard solution, Cu 10000μg/mL
Copper foil, 2.0mm (0.08 in.) thick
Copper, Reference Standard Solution, 1000ppm ±1%
Copper flake
Copper rod, 5mm (0.2 in.) dia.
Copper wire, 2.0mm (0.08 in.) dia, Puratronic?
Copper rod, 3.18mm (0.125 in.) dia., Random lengths
Copper slug, 3.175mm (0.125 in.) dia. x 6.35mm (0.25 in.) length
Copper wire, 0.025mm (0.001 in.) dia.
Copper foil, 0.25mm (0.01 in.) thick, Hard, Temper: as rolled
Copper rod, 2.0mm (0.08 in.) dia.
Copper foil, 0.127mm (0.005 in.) thick, Annealed
Copper Thinfoil, 0.01mm (0.0003 in.) thick, Not certified pinhole free
Copper Thinfoil, 0.015mm (0.0006 in.) thick, Not certified pinhole free
Copper, plasma standard solution, Cu 10μg/mL
Copper rod, 6.35mm (0.25 in.) dia.
Copper foil, metals basis
Copper foil, 0.25mm (0.01 in.) thick
Copper foil, Alloy 101, Oxygen-Free High Conductivity (OFHC), 0.81mm (0.032 in.) thick
Copper foil, 0.127mm (0.005 in.) thick, Annealed, Temper: soft
Copper foil, 0.5mm (0.02 in.) thick, Oxygen free
Copper foil, 1.0mm (0.04 in.) thick
Copper sputtering target, 76.2mm (3.0 in.) dia. x 3.18mm (0.125 in.) thick
Copper plate, Irregular, nominal 10x34x0.6cm (4x13.5x0.25 in.)
Copper wire, 0.1mm (0.004 in.) dia.
Copper tubing, OD: 3.175mm (0.125 in.) ID: 1.5mm (0.059 in.)
Copper foil, 0.675mm (0.027 in.) thick, Annealed, Temper: soft
Copper plate, Alloy 101, Oxygen-Free High Conductivity (OFHC), 2.4mm (0.093 in.) thick
Copper foil, 0.5mm (0.02 in.) thick
Copper tubing, OD: 1.59mm (0.0626 in.) ID: 0.876mm (0.0345 in.)
Copper, Annealed
Copper wire, 0.25mm (0.01 in.) dia.
Copper wire, 0.127mm (0.005 in.) dia., Unannealed
Copper sputtering target, 76.2mm (3.0 in.) dia. x 6.35mm (0.250 in.) thick
Copper tubing, OD: 6.35mm (0.25 in.), ID: 4.72mm (0.186 in.)
Copper wire, 1.0mm (0.04 in.) dia.
Copper shot, 1 to 10mm (0.04 to 0.4 in.)
Copper powder, Oxygen <1000ppm
Copper, For analysis ACS
Copper, Oxygen-Free High Conductivity (OFHC), alloy 101, 1.6mm (0.064 in.) thick
Copper wire, 0.5mm (0.02 in.) dia., Oxygen free
Copper rod, 7mm (0.3 in.) dia.
Copper Metal Shot, 3-14 Mesh
Copper rod, 25.4mm (1.0 in.) dia.
Copper shot, 0.6 to 0.8mm (0.02 to 0.03 in.)
Copper slug, 3.175mm (0.125 in.) dia. x 6.35mm (0.25 in.) length, Oxygen free
Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003 in.) thick
Copper Metal (Turnings)
Copper plate, Alloy 101, Oxygen-Free High Conductivity (OFHC), 3.18mm (0.125 in.) thick
Copper foil (Annealed)
Copper discs, 9.0±0.127mm (0.354±0.005 in.) dia. x 0.8±0.051mm (0.03±0.002 in.) thick
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