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Copper pyrophosphate

CAS No.
10102-90-6
Chemical Name:
Copper pyrophosphate
Synonyms
Cu2P2O7.3H2O;Copper diphosphate;COPPER PYROPHOSPHATE;CUPRIC PYROPHOSPHATE;Pyrophosphate copper;Copper(Ⅱ) pyrophosphate;TetracopperPyrophosphate;COPPER(II)PHOSPHATE,PYRO;COPPER (II) PYROPHOSPHATE;CUPRIC PYROPHOSPHATE DIH2O
CBNumber:
CB8267490
Molecular Formula:
Cu2O7P2
Molecular Weight:
301.04
MDL Number:
MFCD00150226
MOL File:
10102-90-6.mol
Last updated:2024-04-09 22:15:29

Copper pyrophosphate Properties

Melting point 1140 °C
Density 4.2 g/cm3
Water Solubility 9mg/L at 20℃
FDA 21 CFR 582.80
CAS DataBase Reference 10102-90-6(CAS DataBase Reference)
FDA UNII 8027FM9180
EPA Substance Registry System Copper pyrophosphate (10102-90-6)

SAFETY

Risk and Safety Statements

Symbol(GHS)  GHS hazard pictogramsGHS hazard pictograms
GHS07,GHS09
Signal word  Warning
Hazard statements  H332-H319-H410
Precautionary statements  P261-P271-P304+P340-P312-P264-P280-P305+P351+P338-P337+P313P-P273-P391-P501
Risk Statements  36/37/38
Safety Statements  26-36/37/39

Copper pyrophosphate price More Price(7)

Manufacturer Product number Product description CAS number Packaging Price Updated Buy
Biosynth Carbosynth FC149054 Copperpyrophosphate 10102-90-6 5G $94 2021-12-16 Buy
Biosynth Carbosynth FC149054 Copperpyrophosphate 10102-90-6 10g $164 2021-12-16 Buy
Biosynth Carbosynth FC149054 Copperpyrophosphate 10102-90-6 25g $328 2021-12-16 Buy
American Custom Chemicals Corporation ING0010905 COPPER(II) PYROPHOSPHATE 95.00% 10102-90-6 5MG $505.51 2021-12-16 Buy
Biosynth Carbosynth FC149054 Copperpyrophosphate 10102-90-6 50g $570 2021-12-16 Buy
Product number Packaging Price Buy
FC149054 5G $94 Buy
FC149054 10g $164 Buy
FC149054 25g $328 Buy
ING0010905 5MG $505.51 Buy
FC149054 50g $570 Buy

Copper pyrophosphate Chemical Properties,Uses,Production

Pyrophosphate Copper Plating

Pyrophosphate copper plating is widely used copper plating process, which has been used in many electroplating plants in china. This process is characterized by its stability of plating solution, meticulous crystalline coating, a better dispersion ability and coverage ability than that of acidic copper plating and higher cathodic current efficiency than cyanide copper plating. And a thick coating can be obtained with no irritating gas escaping from the electroplating process, which can spare the ventilation equipment. Its bath solution is non-toxic, not corrosive to equipment, which makes it especially suitable for circuit printing and zinc alloy die castings. However, the preparation cost of the plating solution is high, and the long-term use (usually within a few years) will cause the accumulation of orthophosphate, so that the deposition rate will decrease significantly. In addition, direct pyrophosphate copper plating on the kinds of metal base with  low electric potential such as steel, aluminum alloy and zinc alloy, will fail without preplating or pretreatment, which ensures the bonding force between the coating and the substrate.
Copper pyrophosphate, which is the main raw material for the preparation of copper plating bath, is mainly used for non-cyanide plating. It reacts in the bath with potassium pyrophosphate, the complexing agent, to form pyrophosphate copper ligand ion:
 Cu2P2O7+3K4P2O7 = 2K6[Cu (P2O7) 2];
c→6K++[Cu (P2O7) 2]6-
Copper content in plating bath has a significant effect on the cathodic polarization and current density range. The copper content in plating bath is controlled at 22~27g/L in the common copper plating, and 27~35g/L for bright copper plating. Low copper content will give a low deposition rate, a narrow current density range allowed and poor brightness and smoothness; and high copper content will decrease the cathode polarization and result in a rough plating coat. In this case, to get a good coating, a corresponding increase in the content of potassium pyrophosphate is needed, but it will also increase the viscosity of the plating solution and thus reduce the conductive ability and dispersion ability of the plating bath; and the plating solution loss adhered to workpiece surface will be increased, resulting in the increase of production cost and the burden of wastewater treatment.
Because of its complexation effect on divalent bivalent copper ion and tetravalent tin ion, potassium pyrophosphate is the main complexing agent in the bath. In addition to the copper complex, there must be free to keep a certain amount of potassium pyrophosphate in the plating bath to make the complex more stable and prevent copper pyrophosphate from precipitation, therefore to improve the dispersive ability of the bath and ensure the normal dissolution of the anodes.

Physical and Chemical Properties

Copper pyrophosphate appears as light green powder soluble in acid and not soluble in water. It can react with potassium pyrophosphate to form soluble potassium pyrophosphatecopper(Ⅱ).

Application

Copper pyrophosphate is mainly used in non-cyanide plating, supplying copper ions in the plating bath.
Used in the copper base of decorative maskant and carburization.
Used as analytical reagent.
Used in the preparation of phosphate pigments.

Synthesis

Double Decomposition
The copper sulfate and the anhydrous sodium pyrophosphate solution are respectively dissolved into solutions of certain concentration. After filtering and purification, the copper sulfate solution is added into the reactor, and a predetermined amount of anhydrous sodium pyrophosphate solution is added dropwise under the stirring for metathesis reaction to form copper pyrophosphate. Control pH between 5 and 5.5. And copper pyrophosphate is obtained after filtration, rinsing with water, centrifugal separation and drying.

Chemical Properties

used in electroplating copper [HAW93]

Flammability and Explosibility

Non flammable

Copper pyrophosphate Preparation Products And Raw materials

Raw materials

Preparation Products

Global( 220)Suppliers
Supplier Tel Email Country ProdList Advantage
Jiangsu Kolod Food Ingredients Co.,Ltd.
+86-518-85110578 +8618805133257 sales3257@jskolod.com China 132 60
Hebei Mojin Biotechnology Co., Ltd
+8613288715578 sales@hbmojin.com China 12457 58
Henan Fengda Chemical Co., Ltd
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View Lastest Price from Copper pyrophosphate manufacturers

Image Update time Product Price Min. Order Purity Supply Ability Manufacturer
	Copper pyrophosphate pictures 2024-04-09 Copper pyrophosphate
10102-90-6
US $8.00-0.80 / KG 1KG 99% g-kg-tons, free sample is available Henan Fengda Chemical Co., Ltd
copper pyrophosphate pictures 2023-12-10 copper pyrophosphate
10102-90-6
US $211.00 / KG 25KG 32%-34% 200 ton s Jiangsu Kolod Food Ingredients Co.,Ltd.
Copper pyrophosphate pictures 2023-10-24 Copper pyrophosphate
10102-90-6
US $0.00-0.00 / kg 1kg 0.99 50000kg Hebei Yibangte Import and Export Co. , Ltd.
Cupricpyrophosphate,trihydra pyrophosphoricacid,coppersalt COPPER (II) PYROPHOSPHATE COPPER(II) DIPHOSPHATE TETRAHYDRATE COPPER PYROPHOSPHATE diphosphoric acid copper salt CUPRIC PYROPHOSPHATE CUPRIC PYROPHOSPHATE DIH2O TetracopperPyrophosphate Cu2P2O7.3H2O Copper diphosphate Copper(Ⅱ) pyrophosphate COPPER(II)PHOSPHATE,PYRO Copper (II) pyrophosphate, P2üO5ü 40% Diphosphoric acid α,α:β,β-dicopper(II) salt copper pyrophosphate pentahydrate Diphosphoric acid, copper salt (1:) Copper pyrophosphate ISO 9001:2015 REACH Pyrophosphate copper 10102-90-6 Copper pyrophosphate 10102-90-6 Cu2P2O7212H2O Cu2O7P2 Cu2P2O7 Cu2H4O9P2 Inorganics