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질화 알루미늄

질화 알루미늄
질화 알루미늄 구조식 이미지
카스 번호:
24304-00-5
한글명:
질화 알루미늄
동의어(한글):
질화알루미늄;질화알루미늄(ALUMINUMNITRIDE)
상품명:
Aluminum nitride
동의어(영문):
AlN;ALN A;ALN C;ALN B;ALN AT;Nitriloaluminum;Diameter(mm),10;Diameter(mm),22;ALUMINUM NITRIDE;ALUMINIUM NITRIDE
CBNumber:
CB1289123
분자식:
AlN
포뮬러 무게:
40.99
MOL 파일:
24304-00-5.mol

질화 알루미늄 속성

녹는점
>2200 °C (lit.)
밀도
3.26 g/mL at 25 °C (lit.)
RTECS 번호
BD1055000
용해도
Soluble in mineral acids.
물리적 상태
powder
색상
White to pale yellow
Specific Gravity
3.26
수용성
MAY DECOMPOSE
감도
Moisture Sensitive
Crystal Structure
Hexagonal, Wurtzite (Zincite) Structure - Space Group P 63mc
Merck
14,353
안정성
Stable.
InChIKey
PIGFYZPCRLYGLF-UHFFFAOYSA-N
CAS 데이터베이스
24304-00-5(CAS DataBase Reference)
NIST
Aluminum nitride(24304-00-5)
EPA
Aluminum nitride (AlN) (24304-00-5)
안전
  • 위험 및 안전 성명
  • 위험 및 사전주의 사항 (GHS)
위험품 표기 Xi,C
위험 카페고리 넘버 36/37/38-34
안전지침서 26-37/39-45-36/37/39
유엔번호(UN No.) UN3178
WGK 독일 3
TSCA Yes
위험 등급 4.1
포장분류 II
HS 번호 28500090
기존화학 물질 KE-01008
그림문자(GHS):
신호 어: Danger
유해·위험 문구:
암호 유해·위험 문구 위험 등급 범주 신호 어 그림 문자 P- 코드
H314 피부에 심한 화상과 눈에 손상을 일으킴 피부부식성 또는 자극성물질 구분 1A, B, C 위험 P260,P264, P280, P301+P330+ P331,P303+P361+P353, P363, P304+P340,P310, P321, P305+ P351+P338, P405,P501
H315 피부에 자극을 일으킴 피부부식성 또는 자극성물질 구분 2 경고 P264, P280, P302+P352, P321,P332+P313, P362
H319 눈에 심한 자극을 일으킴 심한 눈 손상 또는 자극성 물질 구분 2A 경고 P264, P280, P305+P351+P338,P337+P313P
H335 호흡 자극성을 일으킬 수 있음 특정 표적장기 독성 - 1회 노출;호흡기계 자극 구분 3 경고
예방조치문구:
P261 분진·흄·가스·미스트·증기·...·스프레이의 흡입을 피하시오.
P280 보호장갑/보호의/보안경/안면보호구를 착용하시오.
P310 즉시 의료기관(의사)의 진찰을 받으시오. 삼켰다면 즉시 의료기관(의사)의 도움을 받으시오.
P304+P340 흡입하면 신선한 공기가 있는 곳으로 옮기고 호흡하기 쉬운 자세로 안정을 취하시오.
P305+P351+P338 눈에 묻으면 몇 분간 물로 조심해서 씻으시오. 가능하면 콘택트렌즈를 제거하시오. 계속 씻으시오.
P405 밀봉하여 저장하시오.

질화 알루미늄 MSDS


Aluminum nitride

질화 알루미늄 C화학적 특성, 용도, 생산

화학적 성질

Crystalline solid.

Characteristics

Aluminum nitride is an excellent substrate for creating wide-band-gap semiconductors for wireless communications and power-industry applications. Since aluminum nitride withstands very high temperatures, this substrate material can be used for microelectronic devices on jet engines. Such substrates also would improve the production of blue and ultraviolet lasers that could be used to squeeze a full-length movie onto a CD. Aluminum nitride crystals have also been grown in a tungsten crucible at 2300°C.

용도

In semiconductor electronics; in steel manufacture. AlN components and substrates are used in electrical engines, microelectronics, naval radio and defense systems, railway transport systems, telecommunications and research satellites, and emission control systems.

제조 방법

Aluminum nitride is conveniently prepared by an electric arc between aluminum electrodes in a nitrogen atmosphere. Crucibles of the pressed powder, sintered at 1985°C, are resistant to liquid aluminum at 1985°C, to liquid gallium at 1316°C, and to liquid boron oxide at 1093°C. Aluminum nitride has good thermal shock resistance and is only slowly oxidized in air (1.3% converted to Al2O3 in 30 h at 1427°C). It is inert to hydrogen at 1705°C but is attacked by chlorine at 593°C.

공업 용도

Aluminum nitride is an excellent substrate for creating wide-band-gap semiconductors for wireless communications and power-industry applications. Since aluminum nitride withstands very high temperatures, this substrate material can be used for microelectronic devices on jet engines. Such substrates also would improve the production of blue and ultraviolet lasers that could be used to squeeze a full-length movie onto a CD. Aluminum nitride crystals have also been grown in a tungsten crucible at 2300 C.

Materials Uses

Aluminum nitride (AlN) has an unusual combination of properties: it is an electrical insulator, but an excellent conductor of heat. This is just what is wanted for substrates for high-powered electronics; the substrate must insulate yet conduct the heat out of the microchips. This, and its high strength, chemical stability, and low expansion give it a special role as a heat sinks for power electronics. Aluminum nitride starts as a powder, is pressed (with a polymer binder) to the desired shape, then fired at a high temperature, burning off the binder and causing the powder to sinter.
Aluminum nitride is particularly unusual for its high thermal conductivity combined with a high electrical resistance, low dielectric constant, good corrosion, and thermal shock resistance.
Typical uses. Substrates for microcircuits, chip carriers, heat sinks, electronic components; windows, heaters, chucks, clamp rings, gas distribution plates.

질화 알루미늄 준비 용품 및 원자재

원자재

준비 용품


질화 알루미늄 공급 업체

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