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COPPER POWDER, -100 MESH, 99% (METALS BASIS)
99268-54-9copper(II)-N-salicyloyl-N'-(2-furylthiocarbonyl)hydrazine
copper gallium diselenide
59778-91-5Copper, di-.mu.-chlorobis(dipropylcarbamodithioato-.kappa.S,.kappa.S)di-
Copper(II) nitrite
锑化二铜
Copper(II) trihydroxide ion(-1)
66923-66-8乙酸铜
72480-58-1Copper, diazotized 2-amino-1,4-benzenedisulfonic acid-diazotized 2-[(4-aminophenyl)amino]-5-nitrobenzenesulfonic acid-diazotized 4-nitrobenzeneamine-Dyer's mulberry extract coupling products complexes
COPPER WIRE, 0.025MM (0.001IN) DIA, PURATRONIC®, 99.995% (METALS BASIS)
12069-69-1碱式碳酸铜
660-60-6硬脂酸铜
COPPER NAPHTHENATES SOLUTION 100UG/ML IN ACETONITRILE 1ML
80056-12-8Copper-67(II) chloride
85187-41-3copper(2+) glycerol phosphate
copper(2+) heptanoate
2-Copper 1-magnesium
COPPER ETHYLHEXANO-ISOPROPOXIDE
Copper(II) di(N.N-diethanolamine) ion(+2)
124719-24-0Copper, 29H,31H-phthalocyaninato(2-)-N29,N30,N31,N32-, sulfo 3-(trimethylammonio)propylaminosulfonyl derivs., Me sulfates, sodium salts
14721-21-2二氯酸铜盐
copperhead venom procoagulant enzyme
重铬酸铜
135821-00-0copper dichlorate tetrahydrate
69140-61-0copper dipotassium (1-hydroxyethylidene)bisphosphonate
COPPER WIRE, 1.0MM (0.04IN) DIA, PURATRONIC®, 99.999% (METALS BASIS)
COPPER (II) SULFATE, MONOHYDRATE
Copper(II) diethylenediamine ion(+2)
10060-13-6氯化铜铵二水物
10031-43-3硝酸铜三水合物
COPPERPLASMAEMISSIONSTANDARD,1ML=10MGCU
COPPERSULFATE,10%(W/V)SOLUTION
127913-88-6copper-thiosemicarbazone complex
Copper(II) mono(L-alpha-alanine) ion(+1)
7798-23-4磷酸铜(2+)(2:3)
COPPER - 4% HNO3 100ML
Copper(II) orthophosphate trihydrate
123333-88-0三氟乙酸铜水合物
22992-96-7copper palmitate
copper thionein
copper platinum chloride
540-16-9丁酸铜
Copper(II) ion(+2)
COPPER-COUNT(R)-N
13587-24-1copper hydrogen phosphate
16048-96-7水杨酸铜
142-71-2醋酸铜
Copper(II) tri(diethanolmethylamine) ion(+2)
Copper(II) di(L-alpha-alanine)
7440-50-8Copper
COPPER(II) BROMIDE, ANHYDROUS
COPPER POWDER, -625 MESH, APS 3.25-4.75 MICRON, 99.9% (METALS BASIS)
17652-46-9吡硫鎓铜
32276-75-8copper(2+) 2,2-dimethyloctanoate
COPPER TURNINGS, 99+% (METALS BASIS)
7789-45-9Copper(II) bromide
COPPER DIMETHYLAMINOETHOXIDE/ 99.9%
Copper Radioisotopes
Copper oxide,30-50nm APS powder
COPPER POWDER, -625 MESH, APS 0.75-1.5 MICRON, 99% (METALS BASIS)
53383-24-7CopperLysinate3%
Copper (II) sulfate hydrate
14875-91-3新铜试剂项目
125769-67-7邻亚二甲苯基二(N,N-二异丁基二硫代氨基甲酸酯)
COPPER HISTIDINATE
Copper(II) monohydroxide ion(+1)
COPPER-(II)-CITRATE DIHYDRATE
COPPER SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS)
Copper silicofluoride
CopperPigment
Copper&BrassDip
Copper(II) hydrogen citrate
邻氨基(苯)酚铜盐
Copper(II) DTPA ion(-3)
5893-71-0酒石酸铜
COPPER PEPTONATE
COPPER POWDER, -40+100 MESH, 99.5% (METALS BASIS)
55072-57-6Copper-zinc sulfate complex
COPPER (II) SULFATE, ANHYDROUS
14984-71-5亚硝酸铜
Copper(I) selenide
10257-54-2一水合硫酸铜
7144-37-8copper bis(4-toluenesulphonate)
铜
14958-34-0氧化钒铜
155773-67-45,9,14,18,23,27,32,36-八丁氧基-2,3-萘酞菁铜(II)
93918-23-1copper(2+) neoundecanoate
11108-64-8铜铍合金棒
Copper Sulfate Suspension 10%
钨酸铜
55671-32-4Copper, ethanedioato(2-)-.kappa.O1,.kappa.O2-, hydrate (2:1)
COPPER 1,000 PPM ICP STANDARD SOLUTION
COPPER SHOT, 0.8-2MM (0.03-0.08IN), 99.5% (METALS BASIS)
COPPER FOIL, 0.05MM (0.002IN) THICK, ANNEALED, 99.8% (METALS BASIS)
COPPER-LEAD ALLOY
COPPER 2 PPM STANDARD SOLUTION
饱和硫酸铜溶液
CopperSebicate13%CuPowder,Copper(MetallicElement)
1317-38-0Copper(II) oxide
COPPER SLUG, 6.35MM (0.25IN) DIA X 12.7MM (0.50IN) LENGTH, 99.996% (METALS BASIS)
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