BERGQUIST SP900S SIL PAD TSP 1600S SIL PAD 900S

BERGQUIST SP900S Features and Benefits:


• Thermal impedance: ：0.61°C-in2/W(@50 psi)

• Electrically isolating

• Low mounting pressures

• Smooth and highly compliant surface

• General-purpose thermal interface material solution

BERGQUIST SP900S, SIL PAD 900S,  SIL PAD TSP 1600S  

The true workhorse of the SIL PAD  product family, SIL PAD900S (SP900S)thermally  conductive insulation material 

is designed for a wide variety of applications  requiring high thermal performance and electrical isolation. 

These applications  also typically have low mounting  pressures for component™clamping.

SIL PAD 900S (SIL PAD TSP 1600S)material combines a smooth and highly compliant surface  characteristic with 

high thermalconductivity. These features optimize the thermal resistance properties at  low pressures.

Applications requiring low component  clamping forces include discrete semiconductors (TO-220, TO-247

 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount 

of force to the semiconductor. The smooth surface texture of SIL PAD 900S minimizes interfacial thermal

 resistance and  maximizes thermal performance.

Typical Applications Include:

• Power supplies

• Automotive electronics

• Motor controls

• Power semiconductors

Configurations Available:

• Sheet form, die-cut parts and roll form

• With or without pressure sensitive adhesive