DNR-L300
NEGATIVE RESIST FOR LIFT-OFF PROCESS
Characteristics
DNR-L300 is alkaline developable chemical amplification negative (CAN)
Photoresist suitable for lift-off process.
Reverse Taper Pattern Profile
Simple Process
Developable in alkali solution (aq. TMAH, KOH)
Strippable in positive stripper
(organic solvent including amine)
Thick film formation available
High sensitivity in thick film
Good adhesion
Based on safety-solvent
| DNR-L300-30 | DNR-L300-40 | D1(21.8cp) | D1(86.7cp) |
Solid Content (%) | 30.5 | 40.5 | 31.0 | 38.8 |
Viscosity (mPa.s) | 22.0 ± 5.0 | 120 ± 25 | 22 ± 2.0 | 86.5 ± 5.0 |
Water Content (%) | Less than 0.3 % |
Metal impurity (ppb ; Na) | < 100 | < 100 | < 500 | < 500 |
Metal impurity (ppb ; Fe) | < 150 | < 150 | < 500 | < 500 |
Film Thickness Mark on DNR-L300 Series
DNR-L300-(40)-(D1)
Product Number DNR-L300
“40” Solid Content (%)
“D1”Dyed Version
Standard Products
DNR-L300-30
DNR-L300-40
DNR-L300-D1(21.8cp)
DNR-L300-D1(86.7cp)
Recommended Process ConditionS
1. Substrate preparation : remove moisture and HMDS treatment
2. Coating : spin coating
3. Soft-bake : 90 ℃ / 90sec on hot plate
4. Exposure : near UV 350-440㎚ (Broad Band)
5. PEB(post-exposure bake) : 110 ℃ / 90sec on hot plate
6. Develop : TMAH 2.38% [DPD-200], 60sec puddle or immersion
7. DI rinse
正胶：DHK-BF511
关键字： DNR-L300-D1;东进负胶;台湾东进负胶;负性光刻胶;韩国东进负胶;