StructureChemical NameCASMF
Copper(II) diammonia ion(+2) CuH6N2+2
copper dilaurate 19179-44-3 C24H46CuO4
COPPER SULPHATE HYDRATE CuH2O5S
COPPER(II) TRIFLUOROACETYLACETONATE 14324-82-4 C10H8CuF6O4
COPPER (II) AMMONIUM CHROMATE Cr2CuH8N2O8
COPPER FERRITE 37220-43-2 CuFeH2O
COPPER(I)TERT-BUTOXIDE C4H9CuO
Copper(I) dicyanide ion(-1) C2CuN2-1
COPPER SULFATE SOLUTION WITH HYDROCHLORIC ACID ClCuHO4S
CopperSulphatePentaCuso4.5H2O:98%
COPPERSULFATE,TECH,LARGE,CRYSTAL(BULK
2-Copper antimony Cu2Sb
COPPERPLATINGWORKERS
CopperSulphate5Hydrate CuH2O5S
COPPER TARTRATE 27004-40-6 C4H4CuO6
COPPER SILICIDE 12159-07-8 CuH4Si
COPPER NONANOATE 83852-51-1
COPPER(I) HEXAFLUORO-2,4-PENTANEDIONATE-CYCLOOCTADIENE COMPLEX 86233-74-1 C13H9CuF6O2
CopperSulphate,CopperSaltViaSulfuricAcidOnCopperOxide
Copper, [29H,31H-phthalocyaninato( 2-)-N29,N30,N31,N32]-, [[3-[(3-aminopropyl)methylamino] propyl]amino]sulfonyl derivs., acetates lactates methanesulfonates 114553-49-0
COPPERDISODIUMETHYLENEDIAMINETETRACETATE C10H12CuN2Na2O8
COPPERACETATE(UNDEFINED) C2H3CuO3
COPPER I HEXAFLUOROPENTANEDIONATE-2-BUTYNE COMPLEX 137007-13-7 C9H7CuF6O2
COPPER BRITE ALTERNATIVE
COPPER(II) IONOPHORE IV 849629-03-4 C28H48N2O2S
COPPER(II)FERRICYANIDE C12Cu3Fe2N12
COPPER (II) CARBONATE, BASIC MONOHYDRATE CH4Cu2O6
COPPER PRETREATMENT POWDER
Copper, [29H,31H-phthalocyaninato(2-)-N29,N30,N31,N32]-, aminosulfonyl sulfo derivs., sodium salts 90295-11-7
COPPERSLAG
COPPERSMELTER
COPPERZINCALLOYS
Copper(II) sulfide 1317-40-4 CuS
Copper(II) triacetate ion(-1) C6H9CuO6-1
COPPERHYDRAZINIUMSULPHATE CuH8N4O4S
Copper(II) gluconate 527-09-3 C12H22CuO14
COPPER ARSENIDE 900531-39-7 AsCu3
copper 2-[(E)-(carbamothioylhydrazinylidene)methyl]-6-methoxy-4-phenyl diazenyl-phenolate 121995-85-5 C30H28CuN10O4S2
COPPERPOTASSIUMHEXACYANOFERRATE(II) 14481-39-1
Copper(II) glycolate C4H6CuO6
COPPER (CU) IN APPROX. 1 M NITRIC ACID
COPPER(II) SULFATE - STANDARD VOLUMETRIC SOLUTION (0.1 M) CuO4S
COPPERCHROMITEZINCOXIDE
COPPERBROMIDE DIMETHYLSULPHIDE
COPPERMESO-TETRAPHENYLPORPHYRINE
COPPER SORBATE C6H7CuO2
COPPER SULFAMATE 14017-38-0 CuH4N2O6S2
COPPER OXIDE WIRE A.C.S. REAGENT CuO
COPPER 10,000 PPM ICP STANDARD SOLUTION Cu
Copper, diazotized 3-amino-5-chloro-4-hydroxybenzenesulfonic acid-2,2'-(1,2-ethenediyl)bis[5-nitrobenzenesulfonic acid]-3-methoxybenzenamine coupling products complexes 92908-13-9 Cu
COPPER2-HYDROXY-5-NONYLBENZENESULPHONATE C30H46CuO8S2
COPPER COATED POLYETHYLENE Cu
Copper, [29H,31H-phthalocyaninetetrasulfonamidato(2-)-N29,N30,N31,N32]-, N-(2-ethylhexyl and 3-methoxypropyl) derivs. 73018-43-6
COPPERBIS(ETHYLACETOACTETATE) C12H18CuO6
COPPER(I)SULPHITE,MONOHYDRATE 10294-49-2 CuH4O4S
COPPER(I)HYDRIDE 13517-00-5
Copper isooctanoate C16H30CuO4
COPPERSULPHATE(HYDRATED)
COPPERSMELTERS
copper(II) hydrogen oxalate C4H2CuO8
COPPERPEPONATE
COPPER(II)ETHYLACETYLACETONATE
COPPERARSENATEHYDROXIDE AsCu2HO5
Copper oxysulfate 12158-97-3 CuH2O5S-2
Copper(II) nitrate 2.5 hydrate CuH5N2O8.5
Copper(II) tetrahydroxide ion(-2) CuH4O4-2
COPPER - 10% HCL 500ML Cu
COPPER - 4% HNO3 250ML Cu
COPPER(II)CHLORIDEHEXAHYDRATE Cl2CuH12O6
COPPER PHOSPHORUS 12517-41-8 CuP
Cuprous iodide 1335-23-5 CuHI
COPPER II BENZOYLTRIFLUOROACETONATE C20H12CuF6O4
Copper(II) monoglycine ion(+1) C2H4CuNO2+1
COPPER AMMONIA CuH3N
COPPERBUTYLPHTHALATE C24H26CuO8
COPPER SPUTTERING TARGET, 76.2MM (3.0IN) DIA X 3.18MM (0.125IN) THICK, 99.999% (METALS BASIS) Cu
Copper(I) ammonium acetate C6H13CuNO6
COPPER ASPARTATE 57609-01-5
COPPERANTIMONYSULPHIDE Cu2S3Sb2
COPPER(II) ACETATE 19955-76-1 C4H6CuO4
COPPER ICP/DCP STANDARD SOLUTION (HNO3) Cu
COPPER-DI-AMMONIUM TITRIPLEX(R)
Copper ammonium complex 16828-95-8 CuH12N4+2
COPPER ACETYL TYROSINATE METHYLSILANOL C12H17CuNO5Si
COPPER(1)BROMIDE(RG)
Copper(Ⅱ) phosphate anhydrous Cu3(PO4)2
COPPER PHOSPHIDE 12019-57-7 Cu3P
COPPER NICKEL SULFIDE 146568-80-1 CuH2NiS
COPPER(II)NITRIDE Cu3N2
COPPER AZIDE 14215-30-6
copper diphosphide 12019-11-3 CuP2
Cupric acetylacetonate 13395-16-9 C10H14CuO4
COPPER(II) OLEATE 1120-44-1 C18H34CuO2
COPPERSALTOFENDOTHALL
COPPERUNDECANOATE 7491-40-9
COPPERLYSINE C12H26CuN4O4
COPPER L-LYSINE C12H26CuN4O4
COPPER FOIL, 1.0MM (0.04IN) THICK, PURATRONIC®, 99.999% (METALS BASIS) Cu
COPPERCHLOROPHYLLINB
COPPERCHROMITEBARIUM
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