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제품 카탈로그 >SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS)
SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS)
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SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS) 구조식 이미지
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- 카스 번호:
- 상품명:
- SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS)
- 동의어(영문):
- SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS)
- CBNumber:
- CB1660180
- 분자식:
- 포뮬러 무게:
- 0
- MOL 파일:
- Mol file
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SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS) 속성
안전
SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS) C화학적 특성, 용도, 생산
SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS) 준비 용품 및 원자재
원자재
준비 용품
SILICON(IV) NITRIDE, MGO BINDER, SPUTTERING TARGET, 50.8MM (2.0IN) DIA X 6.35MM (0.250IN) THICK, 99.9% (METALS BASIS) 공급 업체
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