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Aluminum nitride

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CAS:24304-00-5
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Products Intro: Product Name:aluminium nitride
CAS:24304-00-5
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Lastest Price from Aluminum nitride manufacturers

  • Aluminum nitride
  • US $1.00 / KG
  • 2019-07-10
  • CAS:24304-00-5
  • Min. Order: 1KG
  • Purity: 99%
  • Supply Ability: 100kg
  • aluminum nitride
  • US $27.00 / KG
  • 2018-04-25
  • CAS:24304-00-5
  • Min. Order: 25KG
  • Purity: 99%
  • Supply Ability: 1000tons

Related articles

Aluminum nitride Basic information
Physical Properties Uses Reactions
Product Name:Aluminum nitride
Synonyms:AlN Target 99.9%;Thermal conductive aluminium nitride powder;Micro-nano Aluminum Nitride Powder;AlN;Aluminum nitride (AlN);Aluminum nitride Thermocouple Protective Tube (one end closed):OD (mm), 16:ID (mm), 9;ALN A;ALN AT
CAS:24304-00-5
MF:AlN
MW:40.99
EINECS:246-140-8
Product Categories:13: Al;Ceramics;Materials Science;Nanomaterials;Nanoparticles: Oxides, Nitrides, and Other CeramicsMetal and Ceramic Science;Nanopowders and Nanoparticle Dispersions;NitridesNanomaterials;Metal and Ceramic Science;Nitrides;metal nitride;Inorganics
Mol File:24304-00-5.mol
Aluminum nitride Structure
Aluminum nitride Chemical Properties
Melting point >2200 °C(lit.)
density 3.26 g/mL at 25 °C(lit.)
RTECS BD1055000
solubility Soluble in mineral acids.
form powder
color White to pale yellow
Specific Gravity3.26
Water Solubility MAY DECOMPOSE
Sensitive Moisture Sensitive
Merck 14,353
Stability:Stable.
InChIKeyPIGFYZPCRLYGLF-UHFFFAOYSA-N
CAS DataBase Reference24304-00-5(CAS DataBase Reference)
NIST Chemistry ReferenceAluminum nitride(24304-00-5)
EPA Substance Registry SystemAluminum nitride (AlN) (24304-00-5)
Safety Information
Hazard Codes Xi,C
Risk Statements 36/37/38-34
Safety Statements 26-37/39-45-36/37/39
RIDADR UN3178
WGK Germany 3
TSCA Yes
HazardClass 4.1
PackingGroup II
HS Code 28500090
MSDS Information
ProviderLanguage
Aluminum nitride English
SigmaAldrich English
ACROS English
ALFA English
Aluminum nitride Usage And Synthesis
Physical PropertiesWhite crystalline solid, hexagonal; odor of ammonia in moist air; sublimes at 2000°C; melts in N2 atmosphere over 2200°C; decomposes in water, alkalies and acids.
Aluminum nitride
Aluminum Nitride (AlN) is an ideal material for many semiconductor equipment and applications. With high resistance and low porosity, CoorsTek AlN outperforms other materials in process environments such as halogen gases and RF plasma.
Aluminum nitride is a high–thermal conductivity ceramic used as an electronic substrate. Also a key component in the production of sialons.
UsesAluminum nitride (AIN) is an important III-V group semiconductor material, which has aroused great attention due to many outstanding features including high thermal conductivity (~320 Wm10^ -1 K^-1), high electrical resistance (>10^10 Ωcm), low dielectric constant (8.6), wide band gap (6.2eV), and low thermal expansion coefficient (4.2x 10-6°C)-1 match to both Si and GaN semiconductors. AIl these properties make AIN an excellent candidate for use in electronic, light, and field- emission devices.
Aluminum nitride advantages
High heat dissipation with thermal conductivity of 170 W/m K
Non-toxic alternative to BeO
Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors
High dielectric strength.
ReactionsThe nitride reacts with water forming aluminum hydroxide and ammonia.
AlN + 3H2O→ Al(OH)3 + NH3
The compound decomposes in alkalies and acids forming products of complex stoichiometry.
Chemical PropertiesCrystalline solid.
CharacteristicsAluminum nitride is an excellent substrate for creating wide-band-gap semiconductors for wireless communications and power-industry applications. Since aluminum nitride withstands very high temperatures, this substrate material can be used for microelectronic devices on jet engines. Such substrates also would improve the production of blue and ultraviolet lasers that could be used to squeeze a full-length movie onto a CD. Aluminum nitride crystals have also been grown in a tungsten crucible at 2300°C.
UsesIn semiconductor electronics; in steel manufacture. AlN components and substrates are used in electrical engines, microelectronics, naval radio and defense systems, railway transport systems, telecommunications and research satellites, and emission control systems.
PreparationAluminum nitride is conveniently prepared by an electric arc between aluminum electrodes in a nitrogen atmosphere. Crucibles of the pressed powder, sintered at 1985°C, are resistant to liquid aluminum at 1985°C, to liquid gallium at 1316°C, and to liquid boron oxide at 1093°C. Aluminum nitride has good thermal shock resistance and is only slowly oxidized in air (1.3% converted to Al2O3 in 30 h at 1427°C). It is inert to hydrogen at 1705°C but is attacked by chlorine at 593°C.
Industrial usesAluminum nitride is an excellent substrate for creating wide-band-gap semiconductors for wireless communications and power-industry applications. Since aluminum nitride withstands very high temperatures, this substrate material can be used for microelectronic devices on jet engines. Such substrates also would improve the production of blue and ultraviolet lasers that could be used to squeeze a full-length movie onto a CD. Aluminum nitride crystals have also been grown in a tungsten crucible at 2300 C.
Materials UsesAluminum nitride (AlN) has an unusual combination of properties: it is an electrical insulator, but an excellent conductor of heat. This is just what is wanted for substrates for high-powered electronics; the substrate must insulate yet conduct the heat out of the microchips. This, and its high strength, chemical stability, and low expansion give it a special role as a heat sinks for power electronics. Aluminum nitride starts as a powder, is pressed (with a polymer binder) to the desired shape, then fired at a high temperature, burning off the binder and causing the powder to sinter.
Aluminum nitride is particularly unusual for its high thermal conductivity combined with a high electrical resistance, low dielectric constant, good corrosion, and thermal shock resistance.
Typical uses. Substrates for microcircuits, chip carriers, heat sinks, electronic components; windows, heaters, chucks, clamp rings, gas distribution plates.
Aluminum nitride Preparation Products And Raw materials
Raw materialsNitrogen-->Aluminum oxide-->Carbon Black
Tag:Aluminum nitride(24304-00-5) Related Product Information
GALLIUM NITRIDE ALUMINUM NITRIDE OXIDE ALUMINUM NITRIDE CERAMIC BOARD Aluminum nitride crucible, Cylindrical, Flat Base:Height x OD x ID (mm), 25 x 20 x 15: Vol(ml), 5 ALUMINUM NITRIDE CERAMIC RADIATOR ALUMINUM NITRIDE SUBSTRATE CERAMICS ALUMINUM NITRIDE CERAMIC CRUCIBLE ALUMINUM NITRIDE OXIDE SILICIDE,aluminium nitride oxide silicide TITANIUM ALUMINUM NITRIDE ALUMINUM NITRIDE PASTE Aluminum nitride (AlN), solid soln. with silicon carbide (SiC) ALUMINUM NITRIDE CERAMIC BALL BTS-CATALYST Aluminium hydride Aluminum nitride Aluminum sulfate Aluminum Boron nitride