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ChemicalBook CAS DataBase List METHYLPHOSPHONIC ACID

METHYLPHOSPHONIC ACID synthesis

11synthesis methods
-

Yield:-

Reaction Conditions:

with water;oxygen;phenol; pH=4.4 - 13.5 at 280; for 1 h;Conversion of starting material;Autoclave;

Steps:

IV
Dimethyl methylphosphonate, H3C-PO(OCH3)2, was used as a stimulant compound containing a carbon-phosphorus bond and dimethyl sulfoxide, H3C-SO-CH3 (DMSO), was used as a simulant compound containing a carbon-sulfur bond. A solution of dimethyl methylphosphonate (DMMP) and dimethyl sulfoxide (DMSO) in distilled water was prepared. The solution contained 1,249 mg phosphorus/L from DMMP and 2,053 mg sulfur/L from DMSO. Phenol at 4,631 mg/L was added as extraneous organic matter. Tests were performed on portions of the feed at an alkaline, a neutral and an acidic pH. A sample of the solution was placed in an autoclave and pressurized with air to provide sufficient oxygen to oxidize all the oxygen demand of the solution, as well as sufficient overpressure to maintain water in the liquid phase during heating. The autoclave was heated to 280° C. for one hour, then cooled. The gas and liquid phases were analyzed with the results shown in Table IV. TABLE IV DMMP/DMSO/PHENOL Oxidation at 280° C. for 1 Hour Test No. FEED 12 13 14 pH 13.5 6.5 4.4 DMMP-Phos., 1,249 - - - mg/L MPA-Phos., mg/L 0 949 810 874 Ortho-Phos, mg/L 0 216 219 193 C-P Bond, % DRE - 24 35.2 30 DMSO-Sulfur, 2,053 - - - mg/L MSA-Sulfur, mg/L 0 945 385 310 SO4-Sulfur, mg/L 0 842 1553 1615 C-S Bond, % DRE - 53.9 86.1 85.4 Phenol, mg/L 4,631 45 63 24 DMMP was extensively destroyed at all temperatures tested, however only moderate destruction of the carbon-phosphorus bond to produce ortho phosphate was obtained. The methylphosphonic acid (MPA) formed is moderately stable to wet oxidation at the conditions tested, even with phenol added. In contrast, significant destruction of the carbon-sulfur bonds of DMSO and methylsulfonic acid (MSA) was achieved at the test conditions with phenol added.

References:

USFilter Corporation US2005/171390, 2005, A1 Location in patent:Page/Page column 5

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