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24304-00-5

24304-00-5 Structure

24304-00-5 Structure
IdentificationMore
[Name]

Aluminum nitride
[CAS]

24304-00-5
[Synonyms]

ALN A
ALN AT
ALN B
ALN C
ALUMINIUM NITRIDE
ALUMINUM NITRIDE
AlN
Aluminum nitride (AlN)
Aluminumnitride(AlN)
ALUMINUM NITRIDE, NANOPOWDER
ALUMINUM NITRIDE, POWDER, <10 MICRON, 98 +%
Aluminumnitride,N32.0%min
ALUMINUM NITRIDE POWDERS
Aluminium nitride, particle size <10 micron, 98%
Aluminumnitride,agglomeratedpowder
Aluminumnitride,agglomeratedpowder,highpurity
Aluminumnitride,deglomeratedpowder,highpurity
ALN B ALUMINIUM NITRIDE GRADE B-A PRODUCT OF H.C. STARCK
ALN AT ALUMINIUM NITRIDE GRADE AT-A PRODUCT OF H.C. STARCK
ALN C ALUMINIUM NITRIDE GRADE C-A PRODUCT OF H.C. STARCK
[EINECS(EC#)]

246-140-8
[Molecular Formula]

AlN
[MDL Number]

MFCD00003429
[Molecular Weight]

40.99
[MOL File]

24304-00-5.mol
Chemical PropertiesBack Directory
[Appearance]

sheet or powder
[Melting point ]

>2200 °C (lit.)
[density ]

3.26 g/mL at 25 °C(lit.)
[vapor pressure ]

0Pa@25°C
[RTECS ]

BD1055000
[solubility ]

Soluble in mineral acids.
[form ]

powder
[color ]

White to pale yellow
[Specific Gravity]

3.26
[Stability:]

Stable.
[Resistivity]

10*17 (ρ/μΩ.cm)
[Water Solubility ]

MAY DECOMPOSE
[Crystal Structure]

Hexagonal, Wurtzite (Zincite) Structure - Space Group P 63mc
[Sensitive ]

Moisture Sensitive
[Merck ]

14,353
[InChIKey]

PIGFYZPCRLYGLF-UHFFFAOYSA-N
[LogP]

0 at 25℃
[CAS DataBase Reference]

24304-00-5(CAS DataBase Reference)
[NIST Chemistry Reference]

Aluminum nitride(24304-00-5)
[EPA Substance Registry System]

24304-00-5(EPA Substance)
Safety DataBack Directory
[Hazard Codes ]

Xi
[Risk Statements ]

R36/37/38:Irritating to eyes, respiratory system and skin .
[Safety Statements ]

S26:In case of contact with eyes, rinse immediately with plenty of water and seek medical advice .
S37/39:Wear suitable gloves and eye/face protection .
[RIDADR ]

UN3178
[WGK Germany ]

3
[TSCA ]

Yes
[HazardClass ]

4.1
[PackingGroup ]

II
[HS Code ]

28500090
Raw materials And Preparation ProductsBack Directory
[Raw materials]

Nitrogen-->Aluminum oxide-->Carbon Black
Material Safety Data Sheet(MSDS)Back Directory
[msds information]

Aluminum nitride(24304-00-5).msds
Questions And AnswerBack Directory
[Physical Properties]

White crystalline solid, hexagonal; odor of ammonia in moist air; sublimes at 2000°C; melts in N2 atmosphere over 2200°C; decomposes in water, alkalies and acids.
Aluminum nitride
Aluminum Nitride (AlN) is an ideal material for many semiconductor equipment and applications. With high resistance and low porosity, CoorsTek AlN outperforms other materials in process environments such as halogen gases and RF plasma.
Aluminum nitride is a high–thermal conductivity ceramic used as an electronic substrate. Also a key component in the production of sialons.
[Uses]

Aluminum nitride (AIN) is an important III-V group semiconductor material, which has aroused great attention due to many outstanding features including high thermal conductivity (~320 Wm10^ -1 K^-1), high electrical resistance (>10^10 Ωcm), low dielectric constant (8.6), wide band gap (6.2eV), and low thermal expansion coefficient (4.2x 10-6°C)-1 match to both Si and GaN semiconductors. AIl these properties make AIN an excellent candidate for use in electronic, light, and field- emission devices.
Aluminum nitride advantages
High heat dissipation with thermal conductivity of 170 W/m K
Non-toxic alternative to BeO
Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors
High dielectric strength.
[Reactions]

The nitride reacts with water forming aluminum hydroxide and ammonia.
AlN + 3H2O→ Al(OH)3 + NH3
The compound decomposes in alkalies and acids forming products of complex stoichiometry.
Hazard InformationBack Directory
[Chemical Properties]

Crystalline solid.
[Characteristics]

Aluminum nitride is an excellent substrate for creating wide-band-gap semiconductors for wireless communications and power-industry applications. Since aluminum nitride withstands very high temperatures, this substrate material can be used for microelectronic devices on jet engines. Such substrates also would improve the production of blue and ultraviolet lasers that could be used to squeeze a full-length movie onto a CD. Aluminum nitride crystals have also been grown in a tungsten crucible at 2300°C.
[Definition]

ChEBI: Aluminium nitride is a nitride.
[Preparation]

Aluminum nitride is conveniently prepared by an electric arc between aluminum electrodes in a nitrogen atmosphere. Crucibles of the pressed powder, sintered at 1985°C, are resistant to liquid aluminum at 1985°C, to liquid gallium at 1316°C, and to liquid boron oxide at 1093°C. Aluminum nitride has good thermal shock resistance and is only slowly oxidized in air (1.3% converted to Al2O3 in 30 h at 1427°C). It is inert to hydrogen at 1705°C but is attacked by chlorine at 593°C.
[Flammability and Explosibility]

Nonflammable(100%)
[Industrial uses]

Aluminum nitride is an excellent substrate for creating wide-band-gap semiconductors for wireless communications and power-industry applications. Since aluminum nitride withstands very high temperatures, this substrate material can be used for microelectronic devices on jet engines. Such substrates also would improve the production of blue and ultraviolet lasers that could be used to squeeze a full-length movie onto a CD. Aluminum nitride crystals have also been grown in a tungsten crucible at 2300 C.
[Materials Uses]

Aluminum nitride (AlN) has an unusual combination of properties: it is an electrical insulator, but an excellent conductor of heat. This is just what is wanted for substrates for high-powered electronics; the substrate must insulate yet conduct the heat out of the microchips. This, and its high strength, chemical stability, and low expansion give it a special role as a heat sinks for power electronics. Aluminum nitride starts as a powder, is pressed (with a polymer binder) to the desired shape, then fired at a high temperature, burning off the binder and causing the powder to sinter.
Aluminum nitride is particularly unusual for its high thermal conductivity combined with a high electrical resistance, low dielectric constant, good corrosion, and thermal shock resistance.
Typical uses. Substrates for microcircuits, chip carriers, heat sinks, electronic components; windows, heaters, chucks, clamp rings, gas distribution plates.
Spectrum DetailBack Directory
[Spectrum Detail]

Aluminum nitride(24304-00-5)IR
Well-known Reagent Company Product InformationBack Directory
[Acros Organics]

Aluminium nitride, particle size <10 micron, 98%(24304-00-5)
[Alfa Aesar]

Aluminum nitride, N 32.0% min(24304-00-5)
[Sigma Aldrich]

24304-00-5(sigmaaldrich)
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